Semiconductor Engineering

Thermal Analysis Of 3D Stacking And BEOL Technologies With Functional Partitioning Of Many-Core RISC-V SoC

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
MarketWatch

Frore Systems Introduces LiquidJet(TM) Nexus - Defining the AI Thermal Stack for Next-Generation 1/2 U AI Server Systems like NVIDIA Kyber

The MarketWatch News Department was not involved in the creation of this content. SAN JOSE, Calif., March 13, 2026 /PRNewswire/ -- To overcome the thermal barriers limiting AI performance, Frore ...
Optics

Belgian team cuts thermal impact of stacking opto-electronic chips

Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...
Killeen Daily Herald

Frore Systems becomes $1.64B Unicorn as the "Thermal Stack" emerges as Foundational Infrastructure for the AI Era

SAN JOSE, Calif., March 16, 2026 /PRNewswire/ -- Frore Systems today announced it has achieved Unicorn status following the close of a $143 million Series D financing round, bringing total capital ...
EurekAlert!

Thermal impact of 3D stacking photonic and electronic chips

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...
Morningstar

Frore Systems Introduces LiquidJet™ Nexus - Defining the AI Thermal Stack for Next-Generation ½ U AI Server Systems like NVIDIA Kyber

SAN JOSE, Calif., March 13, 2026 /PRNewswire/ -- To overcome the thermal barriers limiting AI performance, Frore Systems today unveiled LiquidJet™ Nexus, a new integrated liquid cooling system ...